Thermal and Electro-Thermal System Simulation

Аннотация

Microelectronics thermal experts from four continents met in the fall of 2018 at the 24th THERMINIC Workshop in Stockholm to discuss the latest issues in the design, characterization, and simulation of thermal and reliability problems in electronic devices and systems. These subjects are gaining more and more importance with increasing power density in electronics systems. The workshop is largely application-oriented and shows a rare balance of contributions from both academy and industry often in great synergy