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Thermal and Electro-thermal System Simulation 2020

M´arta Rencz · Lorenzo Codecasa · Andras Poppe

Учебная литература · 2020

Аннотация

Microelectronics thermal experts from four continents came together in the fall of 2019 at the 25th THERMINIC Workshop at Lake Como in Italy, to discuss the latest issues in the design, characterization and simulation of the thermal and reliability problems in electronic devices and systems. The event, as usual, was sponsored by the IEEE Society, by the IEEE Components, Packaging, and Manufacturing Technology Society, and by numerous companies.

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«Microelectronics thermal experts from four continents came together in the fall of 2019 at the 25th THERMINIC Workshop at Lake Como in Italy, to discuss the latest issues in the design, characterization and simulation…»

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Microelectronics thermal experts from four continents came together in the fall of 2019 at the 25th THERMINIC Workshop at Lake Como in Italy, to discuss the latest issues in the design, characterization and simulation… Полный текст публикации CiteX не хранит — доступ к первоисточнику открывается по DOI согласно лицензии издателя и выбранному плану.

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